Adding ICSP header pins to an Eagle circuit

[Michael Bazzinotti]

Also, I keep talking about holes, What I really want to learn is how to
not only specify the thickness of the hole itself, but also in relation
to the optimal metallic surface to solder to.

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[Joern Paschedag]

Hi guys,
first post.
Let's get right to it.
I'm very inexperienced with Eagle Cad, so it would help to be detailed,
don't go overboard though. Hopefully we find a good match.
I'm looking to modify a pre-existing eagle Schematic and board combo to
include a 3x2 row of pin headers connected to the microcontroller for
easy hookup to do ICSP. I thought it would be great to try this out to
improve and get acquainted with Eagle.
For this project, I am ordering a set of 2-row headers.
http://www.samtec.com/documents/webfiles/pdf/TSW_TH.PDF
I already extracted what I think is the most important information, but
let's review so that you can approve. The two pieces of info I took are
the thickness of the pin itself, and the distance between 2 pins from
their centers.
Pin Thickness: 0.64mm
Distance between center of pins (for all adjacent pins,
up/down/left/right): 2.54 mm
I think these are the most essential pieces to have. Please correct me
if I'm wrong. Once again, this is my first time doing this.
Moving forward, I have some important information that I need to
communicate to Eagle. I want to make, and please pardon my language here
*symantics, I want to place 2 rows of 3 pin headers connected to the
microcontroller as previously stated. Here's a picture of a fabricated
[Loading Image...]
See at the bottom left of the board.
Now, let's take a look at the current image of the board I am working
[Loading Image...]
As we can see, for the most part a single sided board, with the
exception of a few wires on the top.
I want to learn how to route some tracks from certain pins of IC2 to a
special spot for my new pin headers.
a) Create the actual pin headers in software
b) know the correct diameter to specify for those holes. Also, is
there a certain formula that I can go by for the future when I have the
pin thickness that I can use to always know what to use in the future
for the diameter of the hole?
I would really appreciate a step-by-step process for the actual
placement of the pin headers, and how to modify the current state of the
board? I really have no idea where to get started.
Thanks,
Bazz
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Open board and schematic.
The connectors you'll find in the pinhead-lbr.
ADD the connector to your schematic and connect it with NET.
Change now to board and you shall see the new component connected with
airwires.
Place (MOVE) the component and ROUTE the connectins.

[shabaz]

Hi Michael,

  a) Create the actual pin headers in software

The part already exists in EAGLE; see the con-lstb library, it is called
MA03-2. These DIL headers are quite common parts.

   b) know the correct diameter to specify for those holes.

If you know the pin thickness, since it is square, pythagoras' theorem
is used. Or, just use the part mentioned above.

I would really appreciate a step-by-step process for the actual
placement of the pin headers, and how to modify the current state of
the board? I really have no idea where to get started.

There is a tutorial (http://www.cadsoftusa.com/training/tutorials/). If
you follow it entirely, then it will help a lot, because it covers the
entire process.

I mean not only the thickness of the hole itself, but also the optimal
metallic surface size to solder to. How do I calculate that? Are there
standard sizes/presets I should be aware of?

It depends on the board manufacturer's rules, which they publish or you
can request. They will have a rule on the clearance you can have between
pads. As far as I know, there is no standard. Usually, the component
manufacturer will publish a recommended land pattern. For 2.54mm DIL
headers, it is not critical usually, and the con-lstb library may be
sufficient.

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[d r]

2.54 mm is 100mil, which is the same grid you working on.

Pin Thickness: 0.64mm, you need a hole a little bigger than that for the
pins. Then the ring size is auto calculated by Eagle.

You have to create a library object that is a 2x3 header to place on the
board.

ICSP header is to program a new bootloader. Maybe you want FTDI header?

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[d r]

The holes are plated, so yes.

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